Image pickup device with land layout that enables reliable soldering, and mounting board therefor
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United States of America Patent
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Feb 12, 2019
Grant Date -
Jan 18, 2018
app pub date -
Jul 11, 2017
filing date -
Jul 13, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
An image pickup device which ensures reliability of soldering without reinforcement using any additional special members or fixing with an adhesive agent or the like. The image pickup device outputs an image signal corresponding to an optical image. Signal terminals are placed on one surface of the image pick device and soldered to a mounting board on which the image pickup device is to be mounted. Reinforcing terminals provided on the one surface, on which the signal terminal is placed, reinforce the image pickup device. A holding fixing unit holds the image pickup device on the mounting board. When the image pickup device is mounted on the mounting board, the reinforcing terminals are located between the signal terminals and the holding fixing unit.
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