Semiconductor module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10305411
APP PUB NO 20180019695A1
SERIAL NO

15492073

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor module includes a die pad area between positions where a plurality of power terminals are arranged and positions where an HVIC and an LVIC are arranged. A plurality of RC-IGBTs are arranged in the die pad area at positions closer to the plurality of power terminals than to the HVIC and the LVIC.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATION7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 100-8310

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Maki Tokyo, JP 35 542
Shiraishi, Takuya Tokyo, JP 128 1734

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