Magnetic material sputtering target and method for producing same
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United States of America Patent
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app pub date -
Feb 24, 2016
filing date -
Mar 4, 2015
priority date (Note) -
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Abstract
A magnetic material sputtering target formed from a sintered body containing at least Co and/or Fe and B, and containing B in an amount of 10 to 50 at %, wherein an oxygen content is 100 wtppm or less. Since the magnetic material sputtering target of the present invention can suppress the generation of particles caused by oxides, the present invention yields superior effects of being able to improve the yield upon producing magnetoresistive films and the like.
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International Classification(s)
- 2016 Application Filing Year
- C23C Class
- 3247 Applications Filed
- 2111 Patents Issued To-Date
- 65.02 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C23C Class
- 0 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 5, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 5, 2031 |
