Process for fabricating semiconductor nanowires or microwires having insulated roots
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United States of America Patent
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Apr 24, 2018
Issued Date -
N/A
app pub date -
Dec 24, 2015
filing date -
Dec 29, 2014
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Abstract
A process for fabricating an electronic device including a substrate and microwires or nanowires resting on the substrate, the process including successive steps of covering the wires with an insulating layer, covering the insulating layer with an opaque layer, depositing a first photoresist layer over the substrate between the wires, etching the first photoresist layer over a first thickness by photolithography, etching the first photoresist layer remaining after the preceding step over a second thickness by plasma etching, etching the portion of the opaque layer not covered by the first photoresist layer remaining after the preceding step, etching the portion of the insulating layer not covered by the opaque layer, removing the first photoresist layer remaining after the preceding step, and removing the opaque layer.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES | FRANCE PARIS PARIS | |
ALEDIA | PARC D'ENTREPRISES SUD GALAXIE 10 RUE DES MÉRIDIENS ECHIROLLES 38130 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Gibert, Philippe | Saint-Etienne-de-Crossey, FR | 13 | 68 |
Martin, Brigitte | Saint Egreve, FR | 13 | 213 |
Pourquier, Eric | Grenoble, FR | 21 | 100 |
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