Electronic device and methods of fabricating the same
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United States of America Patent
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Jul 23, 2019
Grant Date -
Jan 18, 2018
app pub date -
Mar 22, 2017
filing date -
Jul 13, 2016
priority date (Note) -
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Abstract
Disclosed are an electronic device and a method of fabricating the same. The method of fabricating an electronic device comprises providing on a substrate a channel layer including a two-dimensional material, providing a metal fiber layer on a first surface of a conductive layer, providing the metal fiber layer on the channel layer, and performing a thermal treatment process to form a junction layer where a portion of the metal fiber layer is covalently bonded to a portion of the channel layer.
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