Semiconductor device structure having a doped passivation layer

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United States of America Patent

PATENT NO 10269938
APP PUB NO 20180019327A1
SERIAL NO

15211409

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Abstract

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A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin structure over the base. The fin structure has sidewalls. The semiconductor device structure includes a passivation layer over the sidewalls. The passivation layer includes dopants. The dopants include at least one element selected from group 4A elements, and the dopants and the substrate are made of different materials. The semiconductor device structure includes an isolation layer over the base and surrounding the fin structure and the passivation layer. A first upper portion of the fin structure and a second upper portion of the passivation layer protrude from the isolation layer. The semiconductor device structure includes a gate electrode over the first upper portion of the fin structure and the second upper portion of the passivation layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Yi-Wei Kaohsiung, TW 145 922
Ho, Wen-Zhong Tainan, TW 4 7
Hsu, Chi-Chin Tainan, TW 24 217
Weng, Tzu-Chan Kaohsiung, TW 40 300

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