Electronic device
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United States of America Patent
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Mar 5, 2019
Grant Date -
Jan 18, 2018
app pub date -
Sep 25, 2017
filing date -
Oct 2, 2006
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Abstract
In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.
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