Bonding systems

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United States of America Patent

PATENT NO 10340248
APP PUB NO 20180019225A1
SERIAL NO

15644292

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Abstract

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A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Honda, Masaru Kumamoto, JP 43 413
Inamasu, Toshifumi Kumamoto, JP 14 100
Koga, Takashi Kumamoto, JP 25 197
Masunaga, Takahiro Kumamoto, JP 5 38
Matsunaga, Masataka Kumamoto, JP 13 74
Mimura, Yuji Kumamoto, JP 17 29
Nishimura, Satoshi Kumamoto, JP 67 566
Tamura, Takeshi Kumamoto, JP 54 569

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