Radio frequency (RF) devices
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United States of America Patent
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Dec 4, 2018
Grant Date -
Jan 18, 2018
app pub date -
Sep 27, 2017
filing date -
Sep 29, 2014
priority date (Note) -
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Abstract
A packaged RF device is provided that utilizes flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.
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