Semiconductor package and method of manufacturing the same
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United States of America Patent
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Apr 23, 2019
Grant Date -
Jan 18, 2018
app pub date -
Jun 27, 2017
filing date -
Jul 18, 2016
priority date (Note) -
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Abstract
A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.
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