Integrated circuit apparatus

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United States of America Patent

PATENT NO 10068856
APP PUB NO 20180019210A1
SERIAL NO

15609039

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Abstract

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An integrated circuit apparatus includes a substrate, an IC chip disposed above the substrate, and an electromagnetic shielding layer disposed on a surface of the substrate. The IC chip includes an electromagnetic coupling device. The electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
MEDIATEK INCNO 1 DUSING RD 1ST SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fu, Yuan-Yu Hsinchu County, TW 5 5
Hsu, Chih-Chun New Taipei, TW 11 207
Kao, Jui-Chih New Taipei, TW 6 44
Tsai, Ming-Da Miaoli County, TW 44 236

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