Interposer, module, and method of producing interposer
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United States of America Patent
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app pub date -
Dec 16, 2015
filing date -
Jan 21, 2015
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Abstract
To achieve an interposer being capable of corresponding to a variety of pitch conversions and being inexpensive as compared to the one in the related art. An interposer including a resin lamination including connection terminals for a main board on one surface, and a glass sheet that is fixed along another surface of the resin lamination, the glass sheet having an exposed portion exposed from the resin lamination, the exposed portion being at least a part of a surface not facing to the resin lamination, the glass sheet including connection terminals for a semiconductor device on a surface of the exposed portion, and wiring being formed on a surface of the exposed portion to interconnect the connection terminals with an edge of the exposed portion.
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