Ball grid array (BGA) with anchoring pins
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United States of America Patent
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Apr 24, 2018
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N/A
app pub date -
Jul 18, 2016
filing date -
Jul 18, 2016
priority date (Note) -
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Abstract
Embodiments herein may relate to an electronic device that includes a board. The electronic device may include a device physically coupled with the board by an anchoring pin. The electronic device may further include a plurality of ball grid array (BGA) solder joints coupled with the device. For example, the BGA solder joints may electrically and/or communicatively couple one or more pins of the device with the board. The BGA solder joints may have a shape that is different than the anchoring pin. Other embodiments may be described and/or claimed.
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