Semiconductor package
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United States of America Patent
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Dec 25, 2018
Grant Date -
Jan 18, 2018
app pub date -
Sep 28, 2017
filing date -
Oct 11, 2013
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Abstract
A semiconductor package includes a substrate, a conductive layer, a first surface mount device (SMD) and a bonding wire. The substrate has a t top surface. The first conductive layer is formed on the top surface and has a first conductive element and a first pad separated from each other. The first SMD is mounted on the first pad, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.
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