Stretchable semiconductor packages and semiconductor devices including the same
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United States of America Patent
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May 15, 2018
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app pub date -
Sep 28, 2017
filing date -
Nov 24, 2015
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Abstract
A semiconductor package includes a molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. The molding member includes an extendible material which includes a first part having a warped shape, a second part extending from one end of the first part to be flat, and a third part extending from the other end of the first part to be flat, where first surfaces of the connectors are exposed at a surface of the molding member and second surfaces of the connectors are coupled to the chip.
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