Semiconductor device
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United States of America Patent
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Nov 6, 2018
Grant Date -
Jan 18, 2018
app pub date -
Mar 13, 2017
filing date -
Jul 15, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a technique for enhancing heat dissipation properties in dissipating heat generated in an electrode to a heatsink without impairing bonding properties between the electrode and a wire. In a semiconductor device, a portion of an electrode within an inner region defined by a case, at one surface, i.e., the lower surface with respect to a position in which a wire is connected, a resin portion is provided, the resin portion extending from an inner wall of the case to an upper-surface side of the heatsink. Additionally, in the portion of the electrode within the inner region defined by the case, at one surface, i.e., the lower surface with respect to a position in which the wire is not connected, a thermal conductor is provided, the thermal conductor having higher heat conductivity than the resin portion.
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