Semiconductor package device for power device
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United States of America Patent
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Sep 15, 2020
Grant Date -
Jan 18, 2018
app pub date -
Jul 13, 2017
filing date -
Jul 15, 2016
priority date (Note) -
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Abstract
A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die and the first adhesive layer, and a first conductive via disposed in the first adhesive layer and electrically connected to the first die.
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