Semiconductor device and casing of the semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10121714
APP PUB NO 20180019173A1
SERIAL NO

15606816

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Abstract

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A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled in the casing, a first conductive block disposed in the casing, and a first connection terminal being bent so as to implement an elongated U-shape. The semiconductor device is adapted for electrical connection to a circuit board having a first land. The circuit board is placed on the ceiling wall. The first window is at a position corresponding to the first land. A lower end of the first conductive block is connected to a surface of the output electrode and the first connection terminal contacts to the first conductive block.

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Patent Owner(s)

Patent OwnerAddress
FUJI ELECTRIC CO LTD1-1 TANABESHINDEN KAWASAKI-KU KAWASAKI-SHI KANAGAWA 210-9530

International Classification(s)

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  • 2017 Application Filing Year
  • H01L Class
  • 30754 Applications Filed
  • 25260 Patents Issued To-Date
  • 82.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Komatsu, Kousuke Matsumoto, JP 10 92

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Patent Citation Ranking

  • 0 Citation Count
  • H01L Class
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  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3689997611243481558461392216162801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05001000150020002500300035004000450050005500600065007000750080008500900095001000010500

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