SUBSTRATE TRANSFER DEVICE AND BONDING SYSTEM

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United States of America Patent

APP PUB NO 20180019153A1
SERIAL NO

15644318

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325

International Classification(s)

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  • 2017 Application Filing Year
  • H01L Class
  • 30754 Applications Filed
  • 25260 Patents Issued To-Date
  • 82.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ISHIMARU, Kazutoshi Koshi City, JP 5 66
IWASHITA, Yasuharu Koshi City, JP 9 54
KATSUKI, Shingo Koshi City, JP 5 49
KOGA, Takashi Koshi City, JP 25 197
MASUNAGA, Takahiro Koshi City, JP 5 38
MATSUNAGA, Masataka Koshi City, JP 13 74
SAKATA, Fumio Koshi City, JP 6 26
UMITSUKI, Masaaki Koshi City, JP 3 11

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  • 1 Citation Count
  • H01L Class
  • 23.71 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3689997611243481558461392216162801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05001000150020002500300035004000450050005500600065007000750080008500900095001000010500

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