SUBSTRATE TRANSFER DEVICE AND BONDING SYSTEM
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United States of America Patent
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Issued Date -
Jan 18, 2018
app pub date -
Jul 7, 2017
filing date -
Jul 12, 2016
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Abstract
A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.
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