Adhesive tape sticking apparatus and method of manufacturing a semiconductor package using the same
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United States of America Patent
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Mar 16, 2021
Grant Date -
Jan 18, 2018
app pub date -
Feb 27, 2017
filing date -
Jul 13, 2016
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Abstract
An adhesive tape sticking apparatus includes a chamber includes a lower chamber and an upper chamber. The lower chamber includes a first inner space and the upper chamber includes a second inner space. An adhesive tape sheet is positioned between the upper chamber and the lower chamber. A substrate support is movable upward and downward within the lower chamber and is configured to support a substrate. A differential pressure generator is configured to generate a differential pressure between the first inner space and the second inner space. A tape support plate positioned between a first sidewall of the lower chamber and a circumferential edge of the substrate. The tape support plate is configured to contact at least a portion of the adhesive tape sheet when the adhesive tape sheet bends downward toward the first inner space when the differential pressure is generated between the first and second inner spaces.
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