METHOD FOR PROCESSING ONE SEMICONDUCTOR WAFER OR A PLURALITY OF SEMICONDUCTOR WAFERS AND PROTECTIVE COVER FOR COVERING THE SEMICONDUCTOR WAFER
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United States of America Patent
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app pub date -
Jul 13, 2017
filing date -
Jul 14, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
In various embodiments, a method for processing a semiconductor wafer is provided. The semiconductor wafer includes a first main processing side and a second main processing side, which is arranged opposite the first main processing side, and at least one circuit region having at least one electronic circuit on the first main processing side. The method includes forming a stiffening structure, which at least partly surrounds the at least one circuit region and which stiffens the semiconductor wafer, wherein the stiffening structure has a cutout at least above part of the at least one circuit region, and thinning the semiconductor wafer, including the stiffening structure, from the second main processing side.
First Claim
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