Substrate processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10224226
APP PUB NO 20180019145A1
SERIAL NO

15677587

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided is a substrate processing apparatus, including: transportation chamber maintained in an atmospheric environment where a substrate is transported; a vacuum processing chamber connected with the transportation chamber through a load lock chamber; a substrate placing table installed in the vacuum processing chamber and having a body part and a surface part that is attachable to/detachable from the body part; a storage unit installed in the load lock chamber or the transportation chamber and configured to receive the surface part; and a transportation mechanism configured to transport the substrate from the transportation chamber to the vacuum processing chamber through the load lock chamber and transport the surface part between the storage unit and the body part of the vacuum processing chamber.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325

International Classification(s)

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  • 2017 Application Filing Year
  • H01L Class
  • 30754 Applications Filed
  • 25260 Patents Issued To-Date
  • 82.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sugawara, Eiichi Kurokawa-gun, JP 15 286

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges65791234589227414370441814821601 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +010002000300040005000600070008000900010000110001200013000

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7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 5, 2026
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