Apparatus for processing a substrate and display device by using the same
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United States of America Patent
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Apr 30, 2019
Grant Date -
Jan 18, 2018
app pub date -
Jul 3, 2017
filing date -
Jul 12, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.
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