Input module wiring structure of electronic device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10664023
APP PUB NO 20180017999A1
SERIAL NO

15650723

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677 16677

International Classification(s)

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  • 2017 Application Filing Year
  • G06F Class
  • 61356 Applications Filed
  • 46481 Patents Issued To-Date
  • 75.76 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jo, Myung Jae Gumi-si, KR 1 11
Kang, Hye Won Yongin-si, KR 9 94
Kim, Mu Jin Gumi-si, KR 2 11
Kim, Tae Sik Suwon-si, KR 47 245
Koo, Ja Myeong Suwon-si, KR 5 72
Koo, Jeong Woon Daegu, KR 1 11
Kwon, Dae Heon Gumi-si, KR 3 36
Park, Sei Neu Gumi-si, KR 1 11
Park, Won Hyun Daegu, KR 1 11
Yun, Jae Young Gumi-si, KR 2 11

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Patent Citation Ranking

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  • G06F Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1741626125200659719793632217941101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0200040006000800010000120001400016000180002000022000240002600028000

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