Coupling structures for electronic device housings
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United States of America Patent
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Aug 6, 2019
Grant Date -
Jan 18, 2018
app pub date -
Jul 15, 2016
filing date -
Jul 15, 2016
priority date (Note) -
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Abstract
A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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