Pattern forming method, photo mask manufacturing method, and electronic device manufacturing method

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United States of America Patent

PATENT NO 10488755
APP PUB NO 20180017865A1
SERIAL NO

15718292

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Abstract

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A pattern forming method including a step of coating a substrate with an actinic ray-sensitive or radiation-sensitive resin composition and forming an actinic ray-sensitive or radiation-sensitive film; a step of simultaneously irradiating the actinic ray-sensitive or radiation-sensitive film with a plurality of electron beams; and a step of developing the actinic ray-sensitive or radiation-sensitive film after the irradiation with electron beams is provided. The composition contains a resin (A), a photoacid generator (B), and an acid diffusion control agent (C) and a molar ratio (Qp) between the photoacid generator (B) and the acid diffusion control agent (C), which is represented by Equation (1) is 0.3 or greater.

description='In-line Formulae' end='lead'Qp (molar ratio)=Acid diffusion control agent (C)/Photoacid generator (B)  (1)description='In-line Formulae' end='tail'

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATION26-30 NISHIAZABU 2-CHOME MINATO-KU TOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirano, Shuji Shizuoka, JP 69 341
Mochizuki, Hidehiro Shizuoka, JP 53 342
Takada, Akira Shizuoka, JP 70 537

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