Low force wafer test probe with variable geometry

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United States of America Patent

PATENT NO 10261108
APP PUB NO 20180017596A1
SERIAL NO

15208212

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Abstract

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A system for testing functionality of die on a wafer including a plurality of contacts includes a support structure and a plurality of probes mounted to the support structure in an array. A configuration of each of the plurality of probes varies based on a position of the probe within the array to maintain uniform engagement between the plurality of probes and a corresponding plurality of contacts across the array.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Audette, David M Colchester, US 78 1074
Conti, Dennis R Essex Junction, US 15 194
Knox, Marc D Hinesburg, US 20 116
Wagner, Grant W Burlington, US 11 38

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