INCREASING BOILING HEAT TRANSFER USING LOW THERMAL CONDUCTIVITY MATERIALS

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United States of America Patent

SERIAL NO

15649419

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Abstract

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An apparatus having a heat transfer surface for transfer of heat from the apparatus to a liquid. The heat transfer surface includes at least two different materials and at least two of said materials have different thermal conductivities. A method of boiling at least one liquid which provides increased heat transfer from a heat transfer surface of an apparatus to a liquid comprising a step of boiling said liquid in contact with the apparatus, is also disclosed. Also described is a method of tuning a heat transfer surface by forming the heat transfer surface using at least two different materials having different thermal conductivities arranged in a predetermined spatial relationship including a spacing between the portions of one said material that is from about 0.1λC to about 5λC, wherein λC is a capillary length of a bubble of a predetermined liquid to be boiled using said heat transfer surface.

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Patent Owner(s)

Patent OwnerAddress
DREXEL UNIVERSITY3141 CHESTNUT STREET PHILADELPHIA PA 19104

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
McCarthy, Matthew Media, US 43 276
Pollack, Jordan Forrest Baton Rouge, US 1 0
Rahman, Mahamudur Quincy, US 1 0

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