Liquid cooling

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10458724
APP PUB NO 20180017341A1
SERIAL NO

15717313

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Abstract

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An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP1701 E MOSSY OAKS ROAD SPRING TX 77389

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cader, Tahir Liberty Lake, US 137 897
Franz, John P Houston, US 108 928
Moore, David A Tomball, US 58 777
Sabotta, Michael L Houston, US 30 415

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