LED module and method of sealing
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United States of America Patent
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Jul 16, 2019
Grant Date -
Jan 18, 2018
app pub date -
Jan 25, 2016
filing date -
Feb 5, 2015
priority date (Note) -
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Abstract
This invention relates to the field of lighting modules employing light emitting diodes (LEDs), and more particularly to LED modules suitable for exposed lens plate luminaires. There is herein provided an LED module having a printed circuit board comprising at least two layers, wherein the interface between two layers at a side surface of the printed circuit board is covered by a protrusion of an optically transmissive cover plate. The same said optically transmissive cover plate is also adapted to cover at least one LED positioned in or on the printed circuit board.
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