Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution

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United States of America Patent

PATENT NO 10053794
APP PUB NO 20180016699A1
SERIAL NO

15708281

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Abstract

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Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.

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Patent Owner(s)

Patent OwnerAddress
GLOBALFOUNDRIES U S INC400 STONEBREAK ROAD EXTENSION MALTA NY 12020

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arvin, Charles L Savannah, US 153 801
Biggs, Glen N Wappingers Falls, US 17 67
Palmatier, Phillip W Hopewell Junction, US 17 63
Sorbello, Joseph C Wappingers Falls, US 9 2
Tong, Tracy A Wallkill, US 17 65
Torres, Freddie Beacon, US 10 2

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