AN IMPROVED SUBSTRATE SUPPORT
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United States of America Patent
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Issued Date -
Jan 18, 2018
app pub date -
Jun 14, 2017
filing date -
Jul 13, 2016
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Abstract
An apparatus for processing substrates is described. More particularly, embodiments of the present disclosure relate to an improved substrate support for heating and cooling substrates using turbulent flow during processing. By creating a turbulent flow within the channels, a greater amount of heat is transferred in a shorter period of time. The present design is cost effective and advantageously provides for a more uniform distribution of temperature transfer. In one embodiment, a substrate support assembly is disclosed. The substrate support assembly includes a electrostatic chuck with a surface that is in contact with a substrate and a support plate adjacent the electrostatic chuck. The support plate includes one or more channels, one or more end spaces, and one or more plugs. The substrate support assembly also includes a shaft coupled to the support plate.
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