ADHESIVE COMPOSITION SHEET, METHOD OF PRODUCING SAME, AND SEMICONDUCTOR DEVICE

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United States of America Patent

SERIAL NO

15551663

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.

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Patent Owner(s)

Patent OwnerAddress
TORAY INDUSTRIES INCJAPAN'S TOKYO CENTRAL NIHONBASHI MUROMACHI 2 CHOME 1 NO 1 TOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHINBA, Yoichi Otsu-shi, Shiga, JP 7 87

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