Composition for chemical mechanical polishing and method for reducing chemical mechanical polishing surface defects
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United States of America Patent
Stats
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Sep 4, 2018
Grant Date -
Jan 18, 2018
app pub date -
Jul 14, 2016
filing date -
Jul 14, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present disclosure provides chemical mechanical polishing (CMP) slurry, including an abrasive, a chelator, an oxidizing agent, and a surface modificator. The surface modificator is configured to modify a surface from hydrophobic to hydrophilic. The present disclosure also provides a method for reducing chemical mechanical polishing (CMP) surface defects. The method includes adding an additive into CMP slurry by at least 0.0001 wt %, wherein the additive modifies a surface to be polished from hydrophobic to hydrophilic.
First Claim
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International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- B44C:PRODUCING DECORATIVE EFFECTS
- 2016 Application Filing Year
- C09K Class
- 3076 Applications Filed
- 2094 Patents Issued To-Date
- 68.08 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C09K Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 4, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 4, 2030 |
