Module comprising a MEMS component mounted without subjecting same to stress

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United States of America Patent

PATENT NO 10351416
APP PUB NO 20180016134A1
SERIAL NO

15541316

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Abstract

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A model is specified in which a MEMS component is connected to the carrier in a stress-free fashion over a large temperature range. For this purpose, a mechanical connection comprises a compensation structure which bridges a horizontal offset of mounting points by means of a horizontal shoulder and the thermal expansion coefficient of which is suitably selected.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATION2-5-1 NIHONBASHI CHUO-KU TOKYO 103-6128

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rombach, Pirmin Hermann Otto Kongens Lyngby, DK 32 371

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