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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
BRIDGESTONE CORPORATION	1-1 KYOBASHI 3-CHOME CHUO-KU TOKYO 1048340

International Classification(s)

• B60C:VEHICLE TYRES
• C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS

• 2016 Application Filing Year
• B60C Class
• 1165 Applications Filed
• 752 Patents Issued To-Date
• 64.55 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
OYAMA, Yuji	Tokyo, JP	7	3
# of filed Patents : 7 Total Citations : 3
TSUBOTA, Takeshi	Tokyo, JP	5	0
# of filed Patents : 5 Total Citations : 0

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Patent Citation Ranking

• 0 Citation Count
• B60C Class

• 0 % this patent is cited more than
• 7 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 18, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 18, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2018/0019,173

SEMICONDUCTOR DEVICE AND CASING OF THE SEMICONDUCTOR DEVICE

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Abstract

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A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled in the casing, a first conductive block disposed in the casing, and a first connection terminal being bent so as to implement an elongated U-shape. The semiconductor device is adapted for electrical connection to a circuit board having a first land. The circuit board is placed on the ceiling wall. The first window is at a position corresponding to the first land. A lower end of the first conductive block is connected to a surface of the output electrode and the first connection terminal contacts to the first conductive block.

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Description

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Claims

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