Fluid ejection device with fluid feed holes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 18, 2018
Grant Date -
Jan 18, 2018
app pub date -
Feb 27, 2015
filing date -
Feb 27, 2015
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Abstract
A fluid ejection die has a substrate through which an array of fluid feed holes is formed. The fluid feed holes are separated by ribs. Each fluid feed hole is to guide fluid to an array of drop generators.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
HEWLETT-PACKARD DEVELOPMENT COMPANY L P | 11445 COMPAQ CENTER DRIVE WEST HOUSTON TX 77070 |
International Classification(s)

- 2015 Application Filing Year
- B41J Class
- 2708 Applications Filed
- 2451 Patents Issued To-Date
- 90.51 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chen, Chien Hua | Corvallis, US | 56 | 200 |
# of filed Patents : 56 Total Citations : 200 | |||
Cumbie, Michael W | Corvallis, US | 272 | 997 |
# of filed Patents : 272 Total Citations : 997 | |||
Torniainen, Erik D | Albany, US | 79 | 329 |
# of filed Patents : 79 Total Citations : 329 |
Cited Art Landscape
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Patent Citation Ranking
- 1 Citation Count
- B41J Class
- 28.29 % this patent is cited more than
- 7 Age
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- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 30, 2026 |
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