Fluid ejection device with fluid feed holes

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United States of America Patent

PATENT NO 10112408
APP PUB NO 20180015732A1
SERIAL NO

15545013

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Abstract

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A fluid ejection die has a substrate through which an array of fluid feed holes is formed. The fluid feed holes are separated by ribs. Each fluid feed hole is to guide fluid to an array of drop generators.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT-PACKARD DEVELOPMENT COMPANY L P20555 SH 249 HOUSTON TX 77070

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien Hua Corvallis, US 56 200
Cumbie, Michael W Corvallis, US 272 997
Torniainen, Erik D Albany, US 79 329

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Patent Citation Ranking

  • 1 Citation Count
  • B41J Class
  • 28.29 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges736167514233642111101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 8081 - 9091 - 100100 +0100200300400500600700800900100011001200130014001500160017001800

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