METAL-BONDED SUBSTRATE
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Jan 6, 2016
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Jan 23, 2015
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Abstract
The present invention relates to a metal-bonded substrate and, more specifically, to a metal-bonded substrate in which the bonding force between a nonconductive substrate and a metal layer bonded to each other is remarkably improved. To this end, the present invention provides a metal-bonded substrate comprising: a substrate; a metal layer formed on the substrate; and a self-assembled monomolecular layer formed between the substrate and the metal layer, and composed of a silane chemically linking the substrate and the metal layer, wherein the end group of the silane is composed of an aminosilane containing a saturated or unsaturated hetero atom of a six-membered ring.
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