COMPOSITION FOR FORMING PLATING LAYER, FILM HAVING PLATING LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATING LAYER, CONDUCTIVE FILM, AND TOUCH PANEL
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United States of America Patent
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Sep 27, 2017
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Mar 31, 2015
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Provided are a composition for forming a plating layer, which is capable of forming a metal layer having excellent conductivity by means of a plating treatment and is capable of forming a plating layer having excellent adhesiveness to the metal layer, as well as a film having a plating layer precursor layer, a film having a plating layer, a conductive film, and a touch panel, each of which uses the composition for forming a plating layer.
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