SUBSTRATE STRUCTURE, METHOD FOR ATTACHING FLEXIBLE SUBSTRATE AND METHOD FOR PEELING OFF FLEXIBLE SUBSTRATE
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United States of America Patent
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Nov 11, 2016
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Jan 4, 2016
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Abstract
A substrate structure and methods for method for attaching a flexible substrate and for peeling off a flexible substrate are disclosed. The substrate structure includes a carrier substrate (1) and a flexible substrate (2) disposed on the carrier substrate (1), the substrate structure further including a bonding layer (3) interposed between the carrier substrate (1) and the flexible substrate (2), or more than one bonding layers (3) parallel interposed between the carrier substrate (1) and the flexible substrate (2), wherein the bonding layer (3) includes an electroviscosity layer (31), viscous strength of which changes under effect of electric field, the electroviscosity layer (31) is disposed on a contact surface between the bonding layer (3) and the flexible substrate (2).
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