Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint
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United States of America Patent
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Jun 9, 2020
Grant Date -
Jan 18, 2018
app pub date -
Dec 24, 2015
filing date -
Dec 26, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more.
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