Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint
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United States of America Patent
Stats
-
Jun 9, 2020
Grant Date -
Jan 18, 2018
app pub date -
Dec 24, 2015
filing date -
Dec 26, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more.
First Claim
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International Classification(s)
- 2015 Application Filing Year
- C23C Class
- 3009 Applications Filed
- 2118 Patents Issued To-Date
- 70.39 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- C23C Class
- 58.45 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 9, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 9, 2031 |
