Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder
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United States of America Patent
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Jun 4, 2019
Grant Date -
Jan 18, 2018
app pub date -
Jan 26, 2016
filing date -
Jan 30, 2015
priority date (Note) -
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Abstract
An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4.
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