Family

Loading Family data...

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
PURDUE RESEARCH FOUNDATION	WEST LAFAYETTE IN

International Classification(s)

• A61F:FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES....
• A61B:DIAGNOSIS; SURGERY; IDENTIFICATION

• 2017 Application Filing Year
• A61F Class
• 6751 Applications Filed
• 4708 Patents Issued To-Date
• 69.74 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chiquito, Daniel Madrinan	West Lafayette, US	1	7
# of filed Patents : 1 Total Citations : 7
Duerstock, Bradley Steven	West Lafayette, US	1	7
# of filed Patents : 1 Total Citations : 7
Jacob, Lucas	West Lafayette, US	1	7
# of filed Patents : 1 Total Citations : 7
Manda, Sudhanshu	West Lafayette, US	1	7
# of filed Patents : 1 Total Citations : 7
Suresh, Shruthi	West Lafayette, US	3	45
# of filed Patents : 3 Total Citations : 45

Cited Art Landscape

Load Citation

• No Cited Art to Display

Loading Cited Art Landscape...

Patent Citation Ranking

• 7 Citation Count
• A61F Class

• 21.72 % this patent is cited more than
• 7 Age

Forward Cite Landscape

Load Citation

• No Forward Cites to Display

Loading Forward Cite Landscape...

Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 18, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 18, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2013/0065,403

WAFER CARRIER WITH THERMAL FEATURES

---

Abstract

---

A wafer carrier used in wafer treatments such as chemical vapor deposition has pockets for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with thermal control features such as trenches which form thermal barriers having lower thermal conductivity than surrounding portions of the carrier. These thermal control features promote a more uniform temperature distribution across the wafer surfaces and across the carrier top surface.

---

 

---

Description

---

Claims

---

Claims data not available

---

Legal Events

• No Legal Status data available.