Thermal Pad and Electronic Device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Jan 11, 2018
app pub date -
Sep 6, 2017
filing date -
Jun 29, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A thermal pad and an electronic device comprising the thermal pad includes a first heat conducting layer and a second heat conducting layer. The first heat conducting layer is deformable under compression, and a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is greater than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer. The second heat conducting layer is not deformable under compression, and a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is greater than or equal to a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer.
First Claim
Other Claims data not available