Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board
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United States of America Patent
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Sep 11, 2018
Grant Date -
Jan 11, 2018
app pub date -
Jan 19, 2016
filing date -
Jan 22, 2015
priority date (Note) -
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Abstract
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.
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