Wired circuit board and producing method thereof
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United States of America Patent
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Apr 2, 2019
Grant Date -
Jan 11, 2018
app pub date -
Sep 22, 2017
filing date -
Mar 30, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
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