Method of fabricating a silicon photonic chip with integrated electro-optical component and lens element
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United States of America Patent
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Mar 26, 2019
Grant Date -
Jan 11, 2018
app pub date -
Sep 12, 2017
filing date -
Nov 18, 2015
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Abstract
Embodiments include a silicon photonic chip having a substrate, an optical waveguide on a surface of the substrate and a cavity. The cavity includes an electro-optical component, configured for emitting light perpendicular to said surface and a lens element arranged on top of the electro-optical component. The lens is configured for collimating light emitted by the electro-optical component. The chip also includes a deflector arranged on top of the lens element and configured for deflecting light collimated through the latter toward the optical waveguide. The lens element includes electrical conductors connected to the electro-optical component. The electrical conductors of the lens element may for instance include one or more through vias, one or more bottom electrical lines on a bottom side of the lens element (facing the electro-optical component), and at least one top electrical line.
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