Bonding interface layer
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United States of America Patent
Stats
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Sep 18, 2018
Grant Date -
Jan 11, 2018
app pub date -
Jul 8, 2016
filing date -
Jul 8, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An example device in accordance with an aspect of the present disclosure includes a first layer and a second layer to be bonded to the first layer. The first and second layers are materials that generate gas byproducts when bonded, and the first and/or second layers is/are compatible with photonic device operation based on a separation distance. At least one bonding interface layer is to establish the separation distance for photonic device operation, and is to prevent gas trapping and to facilitate bonding between the first layer and the second layer.
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International Classification(s)
- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 18, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 18, 2030 |
