Bonding interface layer

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United States of America Patent

PATENT NO 10079471
APP PUB NO 20180013260A1
SERIAL NO

15205789

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Abstract

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An example device in accordance with an aspect of the present disclosure includes a first layer and a second layer to be bonded to the first layer. The first and second layers are materials that generate gas byproducts when bonded, and the first and/or second layers is/are compatible with photonic device operation based on a separation distance. At least one bonding interface layer is to establish the separation distance for photonic device operation, and is to prevent gas trapping and to facilitate bonding between the first layer and the second layer.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP1701 E MOSSY OAKS ROAD SPRING TX 77389

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Xue Palo Alto, US 12 12
Liang, Di Palo Alto, US 89 628

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