Structure and wiring substrate
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United States of America Patent
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Sep 18, 2018
Grant Date -
Jan 11, 2018
app pub date -
Jan 5, 2016
filing date -
Feb 12, 2015
priority date (Note) -
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Abstract
Provided is a structure including a first conductor plane (101); a second conductor plane (102); a first transmission line (104) that is formed in a layer different from the first conductor plane (101) and the second conductor plane (102); a second transmission line (105) that is disposed so as to face the second conductor plane (102) in a layer opposite to the first transmission line (104) with respect to the second conductor plane (102); a first conductor via (103) that connects one end of the first transmission line (104) with the first conductor plane (101); a second conductor via (106) that connects another end of the first transmission line (104) with one end of the second transmission line (105); and a slit (107) that is formed on the second conductor plane (102).
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