Fluorine-containing plasma polymerized HMDSO for OLED thin film encapsulation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 15, 2019
Grant Date -
Jan 11, 2018
app pub date -
Sep 11, 2017
filing date -
Mar 4, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Methods for forming an OLED device are described. An encapsulation structure having organic buffer layer sandwiched between barrier layers is deposited over an OLED structure. The buffer layer is formed with a fluorine-containing plasma. The second barrier layer is then deposited over the buffer layer. Additionally, to ensure good adhesion, a buffer adhesion layer is formed between the buffer layer and the first barrier layer. Finally, to ensure good transmittance, a stress reduction layer is deposited between the buffer layer and the second barrier layer.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully